JPH0747900Y2 - 配線基板 - Google Patents
配線基板Info
- Publication number
- JPH0747900Y2 JPH0747900Y2 JP1989037189U JP3718989U JPH0747900Y2 JP H0747900 Y2 JPH0747900 Y2 JP H0747900Y2 JP 1989037189 U JP1989037189 U JP 1989037189U JP 3718989 U JP3718989 U JP 3718989U JP H0747900 Y2 JPH0747900 Y2 JP H0747900Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- wiring pattern
- pressure distribution
- pressing force
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009826 distribution Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 230000004044 response Effects 0.000 description 7
- 238000002788 crimping Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989037189U JPH0747900Y2 (ja) | 1989-03-30 | 1989-03-30 | 配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989037189U JPH0747900Y2 (ja) | 1989-03-30 | 1989-03-30 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02127060U JPH02127060U (en]) | 1990-10-19 |
| JPH0747900Y2 true JPH0747900Y2 (ja) | 1995-11-01 |
Family
ID=31544077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989037189U Expired - Lifetime JPH0747900Y2 (ja) | 1989-03-30 | 1989-03-30 | 配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747900Y2 (en]) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62116578U (en]) * | 1986-01-17 | 1987-07-24 | ||
| JPS63275128A (ja) * | 1987-05-07 | 1988-11-11 | Fuji Electric Co Ltd | 半導体装置 |
| JPS63185229U (en]) * | 1987-05-21 | 1988-11-29 | ||
| JPS6481237A (en) * | 1987-09-22 | 1989-03-27 | Seiko Epson Corp | Semiconductor device |
-
1989
- 1989-03-30 JP JP1989037189U patent/JPH0747900Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02127060U (en]) | 1990-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7871008B2 (en) | Wireless IC device and manufacturing method thereof | |
| US5367435A (en) | Electronic package structure and method of making same | |
| US6782615B2 (en) | Method of surface-mounting electronic components | |
| US6717249B2 (en) | Non-contact type IC card and process for manufacturing-same | |
| US6281048B1 (en) | Method of making an electronic component, and an electronic component | |
| JPH08138022A (ja) | 薄型複合ｉｃカード及びその製造方法 | |
| US6580369B1 (en) | Electronic tag assembly and method therefor | |
| JPH0747900Y2 (ja) | 配線基板 | |
| JP2974686B2 (ja) | 配線基板 | |
| JPH09162230A (ja) | 電子回路装置及びその製造方法 | |
| JP2811713B2 (ja) | 情報カード | |
| JP2785846B2 (ja) | プリント基板回路 | |
| JPH02257648A (ja) | 配線基板 | |
| JPH03218039A (ja) | 半導体素子の実装方法 | |
| US7642126B2 (en) | Method of manufacturing circuits | |
| JPH0789280A (ja) | Ｉｃモジュール | |
| JPH06232204A (ja) | 半導体装置の製造方法 | |
| JP2000252320A (ja) | 半導体装置およびその製造方法 | |
| JP2001273472A (ja) | 非接触ｉｃカード | |
| JPH0751812Y2 (ja) | 配線基板 | |
| JPH10144728A (ja) | 表面実装部品及びこれを用いたプリント配線板 | |
| JP3586867B2 (ja) | 半導体装置、その製造方法及びその実装方法並びにこれを実装した回路基板 | |
| JPH05166884A (ja) | 半導体電子部品 | |
| JPH04241447A (ja) | 半導体モジュール | |
| JP2004062634A (ja) | 非接触通信媒体の接合方法および非接触通信媒体 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |